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IC-EPAE · Registering as Listener

International Conference on Electronics Packaging and Assembly Engineering

24 - 25 Sep 2026 Porto, Portugal Standard / Physical Participation
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$145
virtual · $175 in person
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Registration summary

ConferenceIC-EPAE
ModeVirtual
ParticipationListener
Registration fee$145.00
Bank charges (5.8%)$8.41
Total payable$153.41
Includes all bank processing charges — the amount above is exactly what will be charged.

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• Conference Session Tracks •
SDGs
SDG-Aligned Research Themes

IC-EPAE conference tracks support global knowledge exchange, innovation, and sustainable development priorities across diverse disciplines.

SDG 7 - Affordable and Clean Energy SDG 9 - Industry, Innovation and Infrastructure SDG 11 - Sustainable Cities and Communities SDG 12 - Responsible Consumption and Production
01 Advancements in PCB Design and Fabrication +
This track focuses on innovative techniques and methodologies in printed circuit board (PCB) design and fabrication. Participants will explore the latest trends in materials, processes, and technologies that enhance PCB performance and reliability.
02 Microelectronics and VLSI Design Innovations +
This session will delve into the cutting-edge developments in microelectronics and Very Large Scale Integration (VLSI) design. Researchers will present their findings on design methodologies, circuit optimization, and integration techniques that push the boundaries of miniaturization and performance.
03 Embedded Systems: Challenges and Solutions +
Focusing on the complexities of embedded systems, this track will address the latest research in design, implementation, and optimization. Topics will include real-time systems, software-hardware co-design, and the integration of IoT technologies.
04 Signal Processing Techniques for Electronics Engineering +
This session will explore advanced signal processing techniques applicable to various domains within electronics engineering. Contributions will cover algorithms, hardware implementations, and applications in communications, imaging, and control systems.
05 Control Systems: Theory and Applications +
This track will examine the latest theoretical advancements and practical applications in control systems engineering. Participants will discuss topics such as feedback control, adaptive systems, and the integration of AI in control strategies.
06 Power Electronics: Innovations and Applications +
This session will highlight recent innovations in power electronics, focusing on device technologies, circuit topologies, and applications in renewable energy systems. Researchers will present their work on efficiency improvements and reliability enhancements.
07 Thermal Management in Electronics Packaging +
This track addresses the critical aspects of thermal management in electronics packaging and assembly. Discussions will include modeling techniques, materials selection, and innovative cooling solutions to ensure system reliability and performance.
08 Computational Modeling in Electronics Engineering +
Focusing on computational modeling techniques, this session will cover simulations and analytical methods used in electronics engineering. Topics will include finite element analysis, computational fluid dynamics, and their applications in design and testing.
09 Energy Efficiency in Electronics Systems +
This track will explore strategies for enhancing energy efficiency in electronic systems and devices. Researchers will present methodologies for energy management, optimization techniques, and the role of energy materials in system performance.
10 Testing and Verification in Electronics Engineering +
This session will focus on the latest methodologies and technologies for testing and verification in electronics engineering. Topics will include design for testability, fault detection, and reliability assessment in complex electronic systems.
11 Hardware Optimization and Device Fabrication Techniques +
This track will cover the latest advancements in hardware optimization and device fabrication techniques. Participants will discuss novel approaches to enhance performance, reduce costs, and improve manufacturability in electronic devices.