Flex Conference (Physical / Digital)

International Conference on Forensic Engineering and Structural Failures - (ICFESF-26)

20th - 21st October 2026 , Seoul - South Korea

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Call For Papers

The (ICFESF-26) emphasizes interdisciplinary collaboration by bringing together experts from diverse fields. It encourages research that integrates multiple perspectives to address complex global challenges.

Key areas such as Forensic are explored to promote cross-domain knowledge exchange and collaborative innovation.

Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Forensic Engineering in Structural Failures
  • Case Studies in Forensic Engineering
  • Legal Standards for Engineering Evidence
  • Challenges in Forensic Structural Analysis
  • Role of Engineering in Accident Investigations
  • Innovations in Forensic Engineering Techniques
  • Training for Forensic Engineers
  • Collaboration between Engineers and Law Enforcement
  • Forensic Analysis of Building Materials
  • Ethical Considerations in Forensic Engineering
  • Impact of Design Flaws on Safety
  • Forensic Engineering in Product Liability Cases
  • Future Directions in Forensic Engineering
  • Forensic Analysis of Bridge Failures
  • Use of Technology in Forensic Engineering
  • Forensic Engineering in Fire Investigations
  • Legal Implications of Engineering Failures
  • Forensic Analysis of Construction Accidents
  • Challenges in Forensic Engineering Investigations
  • Forensic Engineering and Public Safety

Assessment

All submissions will undergo peer review to ensure quality and interdisciplinary relevance. Accepted papers will be presented and considered for publication in journals and conference proceedings.

Registration

Registering for the conference provides access to keynote sessions, technical presentations, and networking opportunities with global experts.

Publication

Publishing through the conference enhances the visibility of your research and connects your work with a broader academic audience.