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With ongoing regional conflict and aviation warnings, this event may transition to virtual delivery only, prioritizing participant safety and accessibility.

Flex Conference (Physical / Digital)

International Conference on Electronic Materials and Materials Engineering Applications - (ICEMMEA-27)

17th - 18th March 2027 , Karaj - Iran

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Call For Papers

The (ICEMMEA-27) emphasizes interdisciplinary collaboration by bringing together experts from diverse fields. It encourages research that integrates multiple perspectives to address complex global challenges.

Key areas such as Materials Engineering are explored to promote cross-domain knowledge exchange and collaborative innovation.

Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Electronic materials for semiconductor applications
  • Characterization of electronic materials
  • Materials for flexible electronics
  • Dielectric materials in electronic devices
  • Conductive polymers for electronic applications
  • Nanomaterials in electronic devices
  • Electronic materials for energy storage
  • Challenges in electronic materials development
  • Emerging electronic materials technologies
  • Materials for optoelectronic devices
  • Thermal management in electronic materials
  • Electronic materials for sensors
  • Integration of materials in electronic systems
  • Sustainable practices in electronic materials
  • Future trends in electronic materials research
  • Quality assurance in electronic materials
  • Education in electronic materials engineering
  • Applications of 2D materials in electronics
  • Electronic materials for telecommunications
  • Collaboration in electronic materials innovation

Assessment

All submissions will undergo peer review to ensure quality and interdisciplinary relevance. Accepted papers will be presented and considered for publication in journals and conference proceedings.

Registration

Registering for the conference provides access to keynote sessions, technical presentations, and networking opportunities with global experts.

Publication

Publishing through the conference enhances the visibility of your research and connects your work with a broader academic audience.