Flex Conference (Physical / Digital)

International Conference on Thin Films Engineering and Materials Applications - (ICTFEMA-27)

4th - 5th February 2027 , Lisbon - Portugal

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Call For Papers

The (ICTFEMA-27) emphasizes interdisciplinary collaboration by bringing together experts from diverse fields. It encourages research that integrates multiple perspectives to address complex global challenges.

Key areas such as Materials Engineering are explored to promote cross-domain knowledge exchange and collaborative innovation.

Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Advancements in thin film deposition techniques
  • Characterization methods for thin films
  • Applications of thin films in electronics
  • Thin films in renewable energy systems
  • Nanostructured thin films for sensors
  • Optical properties of thin film materials
  • Thin films for protective coatings
  • Flexible thin film technologies
  • Thin films in biomedical applications
  • Thin film materials for photonics
  • Challenges in thin film fabrication
  • Thin films in energy storage devices
  • Surface engineering of thin films
  • Thin films for corrosion resistance
  • Thin film transistors: current trends
  • Integration of thin films in devices
  • Thin films for thermal management
  • Emerging materials for thin film applications
  • Thin film technologies for aerospace
  • Future directions in thin film research

Assessment

All submissions will undergo peer review to ensure quality and interdisciplinary relevance. Accepted papers will be presented and considered for publication in journals and conference proceedings.

Registration

Registering for the conference provides access to keynote sessions, technical presentations, and networking opportunities with global experts.

Publication

Publishing through the conference enhances the visibility of your research and connects your work with a broader academic audience.