Flex Conference (Physical / Digital)

International Conference on Electronics Packaging and Assembly Engineering - (IC-EPAE-26)

24th - 25th September 2026 , Porto - Portugal

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Call For Papers

The (IC-EPAE-26) emphasizes interdisciplinary collaboration by bringing together experts from diverse fields. It encourages research that integrates multiple perspectives to address complex global challenges.

Key areas such as Electrical and Electronics Engineering are explored to promote cross-domain knowledge exchange and collaborative innovation.

Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Advancements in electronics packaging technologies
  • Thermal management in electronics packaging
  • Reliability testing for electronic assemblies
  • Sustainable practices in electronics packaging
  • Integration of IoT in packaging systems
  • Challenges in electronics assembly processes
  • Quality control in electronics packaging
  • Emerging materials for electronics packaging
  • Design considerations for electronic assemblies
  • Automation in electronics manufacturing
  • Future trends in electronics packaging
  • Supply chain management for electronics assembly
  • Impact of 5G on electronics packaging
  • Electromagnetic compatibility in packaging
  • Case studies in electronics packaging engineering
  • Packaging solutions for wearable electronics
  • Robustness of electronic assemblies
  • Testing methodologies for electronics packaging
  • Industry standards for electronics packaging
  • Research directions in electronics assembly

Assessment

All submissions will undergo peer review to ensure quality and interdisciplinary relevance. Accepted papers will be presented and considered for publication in journals and conference proceedings.

Registration

Registering for the conference provides access to keynote sessions, technical presentations, and networking opportunities with global experts.

Publication

Publishing through the conference enhances the visibility of your research and connects your work with a broader academic audience.